The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2013
Filed:
Jun. 27, 2008
Hirofumi Ebe, Ibaraki, JP;
Yasuto Ishimaru, Ibaraki, JP;
Hirofumi Ebe, Ibaraki, JP;
Yasuto Ishimaru, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
Each wiring pattern is composed of a conductor layer and a tin plating layer, and includes a tip portion, a connection portion and a signal transmission portion. The width of the tip portion is equal to the width of the signal transmission portion, and the width of the connection portion is smaller than the widths of the tip portion and the signal transmission portion. The connection portions of wiring patterns and bumps of an electronic component are connected to one another, respectively, by heat-sealing when the electronic component is mounted. Respective distances A, Aare set to not less than 0.5 μm. Respective distances B, Bare set to not less than 20 μm. The thickness of the tin plating layer is set to not less than 0.07 μm and not more than 0.25 μm.