The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2013

Filed:

Nov. 30, 2009
Applicants:

Jiahua Miao, Iwata, JP;

Akira Sera, Iwata, JP;

Shunsuke Makino, Iwata, JP;

Inventors:

Jiahua Miao, Iwata, JP;

Akira Sera, Iwata, JP;

Shunsuke Makino, Iwata, JP;

Assignee:

NTN Corporation, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F16D 3/205 (2006.01); B21D 22/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A forging method and a full-enclosed forging die contribute to the alleviation of an enclosing force applied to dies and in which a relatively small enclosing apparatus can be used even with respect to larger-sized products. A tripod type constant velocity universal joint is formed with a tripod member molded with the full-enclosed forging die. The full-enclosed forging die includes openable/closable dies and punches for pressing a material between the dies. From the forging die, the tripod member including a boss portion and shaft portions protruded radially from the boss portion is molded.


Find Patent Forward Citations

Miao, Jiahua. (2013). Forging method, closed forging mold and tripod uniform motion universal joint (U.S. Patent No. 8353778). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8353778

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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