The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2013

Filed:

Aug. 20, 2010
Applicants:

Kian Chin Yap, Lebuh Relai, MY;

Phooi Choong Loh, Menglembu, MY;

Kar Keng Chua, Juru, MY;

Inventors:

Kian Chin Yap, Lebuh Relai, MY;

Phooi Choong Loh, Menglembu, MY;

Kar Keng Chua, Juru, MY;

Assignee:

Altera Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method to modify a first IC design into a second IC design, the first and second IC designs specifying a common interconnection layer with a plurality of interconnections, is disclosed. The method includes identifying an interconnection from plurality of interconnections within the common interconnection layer. The interconnection is unused for routing signals in the first IC design. The metal layer that is coupled with the identified interconnection is removed from the first IC design to generate a modified design. The identified interconnection of the first IC design is placed into one of an invisible state or a temporarily removed state in the modified design. The metal layer in the modified design is routed for a specific logic gate design. The modified design is then stored as the second IC design.


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