The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Mar. 12, 2010
Keunwoo Kim, Somers, NY (US);
Soojae Park, Wappingers Falls, NY (US);
Keunwoo Kim, Somers, NY (US);
Soojae Park, Wappingers Falls, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Electrical finite element analysis is carried out on a circuit design, which includes devices, to determine an acceptable power-performance envelope and to obtain data for circuit temperature mapping. A circuit temperature map is developed for the circuit design, based on the data for circuit temperature mapping. Thermo-mechanical finite element analysis is carried out on a package design for the circuit design, based on the circuit temperature map, to determine a package reliability limit based on thermal stress considerations. It is determined whether the package design and the circuit design jointly satisfy: (i) power-performance conditions specified in the acceptable power-performance envelope; and (ii) the package reliability limit based on the thermal stress considerations.