The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2013

Filed:

May. 28, 2010
Applicants:

Takashi Okada, Osaka, JP;

Takumi Mikawa, Shiga, JP;

Koji Arita, Osaka, JP;

Inventors:

Takashi Okada, Osaka, JP;

Takumi Mikawa, Shiga, JP;

Koji Arita, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a memory cell array in which first conductive layers () and second conductive layers () extend above a semiconductor substrate () and three-dimensionally cross with each other, and memory cells each of which includes a current steering element () and a variable resistance element () electrically connected in series to each other is provided at a corresponding one of three-dimensional cross points between the first conductive layers () and the second conductive layers (). The method includes: forming a first interlayer insulating film (); forming a contact hole in the interlayer insulating film (); depositing a first plug material () in the contact hole and on the first interlayer insulating film (); performing a first polishing in which the first plug material () is polished until the first interlayer insulating film () is exposed; depositing a conductive film () that becomes a first electrode () of the current steering element (), on the first plug material () and the first interlayer insulating film () after the first polishing; and performing a second polishing in which a surface of the conductive film () is polished.


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