The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Aug. 02, 2011
Johannes Wilhelmus Weekamp, Eindhoven, NL;
Antonius Constan Johanna Cornelis Van Den Ackerveken, Eindhoven, NL;
Will J. H. Ansems, Eindhoven, NL;
Johannes Wilhelmus Weekamp, Eindhoven, NL;
Antonius Constan Johanna Cornelis Van Den Ackerveken, Eindhoven, NL;
Will J. H. Ansems, Eindhoven, NL;
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Abstract
A package enclosing at least one microelectronic element () such as a sensor die and having electrically conductive connection pads () for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern () to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member () on the carrier at the side where the electrically conductive pattern () is present; removing the sacrificial carrier; and placing a microelectronic element () in a recess () which has been created in the body member () at the position where the elevated portion of the carrier has been, and connecting the microelectronic element () to the electrically conductive pattern (). Furthermore, a hole () is arranged in the package for providing access to a sensitive surface of the microelectronic element ().