The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Aug. 10, 2010
Takashi Ohtsuka, Tokyo, JP;
Kyung-ku Choi, Tokyo, JP;
Tatsuo Namikawa, Tokyo, JP;
Hitoshi Yamaguchi, Tokyo, JP;
Takashi Ohtsuka, Tokyo, JP;
Kyung-Ku Choi, Tokyo, JP;
Tatsuo Namikawa, Tokyo, JP;
Hitoshi Yamaguchi, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
The invention provides an electronic component and a manufacturing method thereof that can achieve an improved adhesion strength when the electronic component is solder-mounted onto an external substrate and can thereby obtain considerably improved electric properties and reliabilities, etc. An electronic component, which is a capacitor, has: a circuit elementformed on a substrate; an electrode layerconnected to the circuit element; passivation layersandthat cover the electrode layer; and terminal electrodesandconnected to the electrode layervia via-conductors Va and Vb formed through the passivation layersand, the terminal electrodesandbeing formed to cover the side wall of the passivation layersand. Since the pad electrodesandare formed so as to cover the passivation layersandacross their uppermost surfaces and side walls, the area of contact between the pad electrodesandand the solder for solder-mounting increases, and the capacitorcan consequently exhibit an improved adhesion strength.