The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2013

Filed:

Dec. 22, 2009
Applicants:

Jun Suzuki, Hamamatsu, JP;

Fumikazu Ojima, Hamamatsu, JP;

Ryusuke Kitaura, Hamamatsu, JP;

Inventors:

Jun Suzuki, Hamamatsu, JP;

Fumikazu Ojima, Hamamatsu, JP;

Ryusuke Kitaura, Hamamatsu, JP;

Assignee:

Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/024 (2006.01);
U.S. Cl.
CPC ...
Abstract

In an infrared sensor () having a bolometer element () and a reference element (), the reference element () comprises a bolometer film (), a substrate-side insulating film () formed on the substrate-side surface of the bolometer film (), a heat dissipation film () made of amorphous silicon formed on the substrate-side surface of the bolometer film () with the substrate-side insulating film () interposed therebetween, and a plurality of heat dissipation columns () made of amorphous silicon thermally connected to the heat dissipation film () and a substrate (), while the bolometer film () and substrate-side insulating film () are formed such as to extend over a side face of the heat dissipation film () intersecting a surface of the substrate (). Thus configured infrared sensor () can efficiently reduce the influence of temperature changes in the environment in use, while being made smaller.


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