The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Mar. 25, 2010
Applicants:
Tetsuya Oosawa, Ibaraki, JP;
Naoyuki Tanaka, Ibaraki, JP;
Mitsuru Honjo, Ibaraki, JP;
Inventors:
Assignee:
Nitto Denko Corporation, Osaka, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 7/00 (2006.01); G11B 21/16 (2006.01); G11B 5/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.
Oosawa, Tetsuya. (2013). Printed circuit board and method of manufacturing the same (U.S. Patent No. 8350159). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8350159
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile