The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Mar. 22, 2011
Yung-chang Chen, Hsinchu, TW;
Hsin-hsien Wu, Hsinchu, TW;
Chyi Shyuan Chern, Taipei, TW;
Ching-wen Hsiao, Hsinchu, TW;
Fu-wen Liu, Hsinchu County, TW;
Kuang-huan Hsu, Hsinchu, TW;
Yung-Chang Chen, Hsinchu, TW;
Hsin-Hsien Wu, Hsinchu, TW;
Chyi Shyuan Chern, Taipei, TW;
Ching-Wen Hsiao, Hsinchu, TW;
Fu-Wen Liu, Hsinchu County, TW;
Kuang-Huan Hsu, Hsinchu, TW;
TSMC Solid State Lighting Ltd., Hsin-Chu, TW;
Abstract
An embodiment of the disclosure includes a method of fabricating a plurality of light emitting diode devices. A plurality of LED dies is provided. The LED dies are bonded to a carrier substrate. A patterned mask layer comprising a plurality of openings is formed on the carrier substrate. Each one of the plurality of LED dies is exposed through one of the plurality of the openings respectively. Each of the plurality of openings is filled with a phosphor. The phosphor is cured. The phosphor and the patterned mask layer are polished to thin the phosphor covering each of the plurality of LED dies. The patterned mask layer is removed after polishing the phosphor.