The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2013

Filed:

Jul. 13, 2007
Applicant:

Uri Cohen, Palo Alto, CA (US);

Inventor:

Uri Cohen, Palo Alto, CA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/08 (2006.01); C25D 7/12 (2006.01); C25D 17/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

One embodiment of the invention is an apparatus for electrochemical deposition (ECD) of a metal or an alloy inside at least one opening located at a front surface of a substrate, said apparatus including: (a) an electrochemical deposition (ECD) cell adapted to contain an electrolyte, the electrolyte including plating metallic ions and at least one inhibitor additive; (b) a cathode including at least a portion of said front surface of the substrate, wherein at least one surface inside said at least one opening includes an exposed metallic surface, and wherein at least a portion of said cathode is immersed in said electrolyte; (c) at least one anode, wherein at least a portion of the at least one anode is immersed in said electrolyte; (d) a power supply adapted to generate an electroplating current through the electrolyte between said cathode and said at least one anode; and (e) means for producing a turbulent flow of the electrolyte across the front surface of the substrate, wherein the turbulent flow is capable of producing a diffusion layer thickness of less than about 50 μm at said front surface of the substrate.


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