The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Dec. 15, 2010
Shintarou Sasaki, Miyagi, JP;
Takanori Aizawa, Miyagi, JP;
Yuji Sakai, Saitama, JP;
Sony Corporation, Tokyo, JP;
Abstract
Provided is a manufacturing method for a non-contact communication medium, including: forming in a first region a first structure including an IC chip mounted on the first region, a first adhesive in an uncured state, which is applied on the IC chip, and a first plate member placed on the first adhesive; forming in a second region a second structure including a second adhesive in an uncured state, which is applied on the second region, and a second plate member placed on the second adhesive; sandwiching the first region and the second region by a first partition wall capable of partitioning the first region and accommodating the first structure and a second partition wall capable of partitioning the second region and accommodating the second structure; and heating the first partition wall and the second partition wall, to thereby thermally cure the first adhesive and the second adhesive, respectively.