The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Jul. 21, 2008
Applicant:
John H. Vontell, Sr., Manchester, CT (US);
Inventor:
John H. Vontell, Sr., Manchester, CT (US);
Assignee:
United Technologies Corporation, Hartford, CT (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/82 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method includes positioning a layer of adhesive between a first structural component and a second structural component, positioning a first evaluation film between the first structural component and the layer of adhesive, curing the adhesive at least partially, separating the first structural component and the first evaluation film by a relative movement therebetween, and inspecting bond line quality of the adhesive.
Vontell, Sr., John. (2013). Method and assembly for validating bond line (U.S. Patent No. 8349104). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8349104
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile