The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8349042 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 08, 2013

Filed:

Mar. 29, 2011
Applicant:

Katsuaki Miyatani, Tokyo, JP;

Inventor:

Katsuaki Miyatani, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 3/02 (2006.01); C09C 1/68 (2006.01); C09K 3/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a polishing slurry including: a colloidal silica having an average particle size of 40 nm or more; water; and a ζ potential adjusting component, in which the ζ potential adjusting component includes at least one water-soluble organic polymer selected from a water-soluble polyether polyamine and a water-soluble polyalkylene polyamine and at least one acid selected from hydrochloric acid, sulfuric acid, nitric acid, nitrous acid and amidosulfuric acid, and the ζ potential adjusting component contains the acid at a ratio of from 0.6 to 1.4 to the water-soluble organic polymer in terms of molar ratio, and the polishing slurry has a pH of 8 or more.


Find Patent Forward Citations

Miyatani, Katsuaki. (2013). Polishing liquid and polishing method (U.S. Patent No. 8349042). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8349042

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