The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Sep. 28, 2007
Brian W. O'krafka, Austin, TX (US);
Ashok V. Krishnamoorthy, San Diego, CA (US);
John E. Cunningham, San Diego, CA (US);
Xuehze Zheng, San Diego, CA (US);
Ilya A. Sharapov, Palo Alto, CA (US);
Ronald Ho, Mountain View, CA (US);
Brian W. O'Krafka, Austin, TX (US);
Ashok V. Krishnamoorthy, San Diego, CA (US);
John E. Cunningham, San Diego, CA (US);
Xuehze Zheng, San Diego, CA (US);
Ilya A. Sharapov, Palo Alto, CA (US);
Ronald Ho, Mountain View, CA (US);
Oracle America, Inc., Redwood Shores, CA (US);
Abstract
Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM).