The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Aug. 29, 2007
Xiaoyu MI, Kawasaki, JP;
Tsuyoshi Matsuomoto, Kawasaki, JP;
Satoshi Ueda, Kawasaki, JP;
Takeo Takahashi, Nagano, JP;
Xiaoyu Mi, Kawasaki, JP;
Tsuyoshi Matsuomoto, Kawasaki, JP;
Satoshi Ueda, Kawasaki, JP;
Takeo Takahashi, Nagano, JP;
Fujitsu Limited, Kawasaki, JP;
Taiyo Yuden Co., Ltd., Tokyo, JP;
Abstract
An electronic part module includes a wiring substrate, a passive device group of passive devices formed on the wiring substrate, and device chips mounted on the wiring substrate. Such an electronic part module is made in the following manner. First, a wiring substrate wafer is made, to include a plurality of electronic part module formation areas. Then, a plurality of passive devices are formed in each of the electronic part module formation areas on the wiring substrate wafer. Then, the device chips are formed on each of the electronic part module formation areas on the wiring substrate wafer. Finally, the wiring substrate wafer is divided.