The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8345431 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 01, 2013

Filed:

Dec. 29, 2008
Applicants:

James E. Clayton, Raleigh, NC (US);

Zakaryae Fathi, Raleigh, NC (US);

Inventors:

James E. Clayton, Raleigh, NC (US);

Zakaryae Fathi, Raleigh, NC (US);

Assignee:

Microelectronics Assembly Technologies, Inc., Research Triangle Park, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.


Find Patent Forward Citations

Clayton, James. (2013). Thin multi-chip flex module (U.S. Patent No. 8345431). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8345431

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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