The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Aug. 09, 2010
Hiroyuki Toyoda, Mito, JP;
Tadakatsu Nakajima, Kasumigaura, JP;
Yoshihiro Kondo, Tsuchiura, JP;
Shigeyuki Sasaki, Kasumigaura, JP;
Akio Idei, Hadano, JP;
Shigemasa Satoh, Hadano, JP;
Hiroyuki Toyoda, Mito, JP;
Tadakatsu Nakajima, Kasumigaura, JP;
Yoshihiro Kondo, Tsuchiura, JP;
Shigeyuki Sasaki, Kasumigaura, JP;
Akio Idei, Hadano, JP;
Shigemasa Satoh, Hadano, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A cooling system for cooling a CPUmounted on a printed circuit boardwithin a housing thereof, has a heat-receiving jacket, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenserreceives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.