The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2013

Filed:

Nov. 13, 2008
Applicants:

Kazuyoshi Torii, Aichi, JP;

Naomichi Miyashita, Kasugai, JP;

Mamoru Musasa, Nagoya, JP;

Akira Suzuki, Nagoya, JP;

Tomoo Tanaka, Kitanagoya, JP;

Osamu Yoshimoto, Inazawa, JP;

Inventors:

Kazuyoshi Torii, Aichi, JP;

Naomichi Miyashita, Kasugai, JP;

Mamoru Musasa, Nagoya, JP;

Akira Suzuki, Nagoya, JP;

Tomoo Tanaka, Kitanagoya, JP;

Osamu Yoshimoto, Inazawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01T 13/20 (2006.01); H01T 21/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A precious metal tip on the side of a ground electrode is indirectly joined to the front end portion of the ground electrode via a mounting part interposed therebetween. The mounting part includes a base part and a protruding part. First, in the state where the precious metal tip is in contact with the protruding part, laser welding or the like is performed thereon to form a fused part and obtain a complex, and the base part is joined to a flat surface of the ground electrode by resistance welding. The grain size of grains of the mounting part in the vicinity of the of the fused part is greater than the grain size of the grain size of the grains thereof in the vicinity of the ground electrode, and the grain size of the grains of the flange part of the mounting part is smaller than the grain size of the grains of the protruding part.


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