The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Sep. 17, 2008
Kuo-len Lin, Wugu Township, Taipei County, TW;
Chen-hsiang Lin, Wugu Township, Taipei County, TW;
Hwai-ming Wang, Wugu Township, Taipei County, TW;
Ken Hsu, Wugu Township, Taipei County, TW;
Chih-hung Cheng, Wugu Township, Taipei County, TW;
Kuo-Len Lin, Wugu Township, Taipei County, TW;
Chen-Hsiang Lin, Wugu Township, Taipei County, TW;
Hwai-Ming Wang, Wugu Township, Taipei County, TW;
Ken Hsu, Wugu Township, Taipei County, TW;
Chih-Hung Cheng, Wugu Township, Taipei County, TW;
CPUMate Inc., New Taipei, TW;
Golden Sun News Techniques Co., Ltd., New Taipei, TW;
Abstract
A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.