The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Jun. 28, 2007
Xin Zhang, Acton, MA (US);
Michael Judy, Ipswich, MA (US);
Kevin H. L. Chau, Danville, CA (US);
Nelson Kuan, Brookline, MA (US);
Timothy Spooner, Dunstable, MA (US);
Chetan Paydenkar, Cambridge, MA (US);
Peter Farrell, Lunenburg, MA (US);
Xin Zhang, Acton, MA (US);
Michael Judy, Ipswich, MA (US);
Kevin H. L. Chau, Danville, CA (US);
Nelson Kuan, Brookline, MA (US);
Timothy Spooner, Dunstable, MA (US);
Chetan Paydenkar, Cambridge, MA (US);
Peter Farrell, Lunenburg, MA (US);
Analog Devices, Inc., Norwood, MA (US);
Abstract
A packaged microchip has a lead frame with a die directly contacting at least a single, contiguous portion of the lead frame. The portion of the lead frame has a top surface forming a concavity and contacting the die. The packaged microchip also has mold material substantially encapsulating part of the top surface of the portion of the lead frame.