The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2013

Filed:

Oct. 11, 2010
Applicants:

Kang Lee, Woodland Hills, CA (US);

Thomas Forrester, Hacienda Heights, CA (US);

Eric Gans, Los Angeles, CA (US);

Kevin Carl Walter, Aliso Viejo, CA (US);

Tomasz Jannson, Torrance, CA (US);

Inventors:

Kang Lee, Woodland Hills, CA (US);

Thomas Forrester, Hacienda Heights, CA (US);

Eric Gans, Los Angeles, CA (US);

Kevin Carl Walter, Aliso Viejo, CA (US);

Tomasz Jannson, Torrance, CA (US);

Assignee:

Physical Optics Corporation, Torrance, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit die comprises a device layer comprising a plurality of semiconductor devices; an interconnect layer comprising a plurality of interconnect paths connecting the semiconductor devices and embedded in a dielectric material; and a plurality of hard nanoparticles embedded in the dielectric material of the interconnect layer, the hard nanoparticles having a hardness greater than a hardness of the dielectric material and of a hardness of the interconnect paths.


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