The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
May. 02, 2011
Jeffrey B. Sampsell, Pueblo West, CO (US);
Clarence Chui, San Jose, CA (US);
Manish Kothari, Cupertino, CA (US);
Mark W. Miles, Atlanta, GA (US);
Teruo Sasagawa, Los Gatos, CA (US);
Wonsuk Chung, San Jose, CA (US);
Ming-hau Tung, San Francisco, CA (US);
Jeffrey B. Sampsell, Pueblo West, CO (US);
Clarence Chui, San Jose, CA (US);
Manish Kothari, Cupertino, CA (US);
Mark W. Miles, Atlanta, GA (US);
Teruo Sasagawa, Los Gatos, CA (US);
Wonsuk Chung, San Jose, CA (US);
Ming-Hau Tung, San Francisco, CA (US);
QUALCOMM MEMS Technologies, Inc., San Diego, CA (US);
Abstract
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.