The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Sep. 14, 2006
Hiroki Tamiya, Koriyama, JP;
Yoshihiko Nakamura, Sukagawa, JP;
Shunji Araki, Koriyama, JP;
Eiji Imaizumi, Tamura-gun, JP;
Kentarou Fujino, Koriyama, JP;
Tomoaki Sawada, Koriyama, JP;
Takashi Shinpo, Koriyama, JP;
Hiroki Tamiya, Koriyama, JP;
Yoshihiko Nakamura, Sukagawa, JP;
Shunji Araki, Koriyama, JP;
Eiji Imaizumi, Tamura-gun, JP;
Kentarou Fujino, Koriyama, JP;
Tomoaki Sawada, Koriyama, JP;
Takashi Shinpo, Koriyama, JP;
Panasonic Corporation, Osaka, JP;
Abstract
An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).