The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Jul. 01, 2008
Applicants:
Mitsuhiko Ogihara, Hachioji, JP;
Hiroyuki Fujiwara, Hachioji, JP;
Ichimatsu Abiko, Tokyo, JP;
Masaaki Sakuta, Tokyo, JP;
Inventors:
Mitsuhiko Ogihara, Hachioji, JP;
Hiroyuki Fujiwara, Hachioji, JP;
Ichimatsu Abiko, Tokyo, JP;
Masaaki Sakuta, Tokyo, JP;
Assignee:
Oki Data Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a method of manufacturing a semiconductor thin film piece device, a plurality of semiconductor thin film pieces () are selected from among the semiconductor thin film pieces () formed on a first substrate (), and bonded to a first set of predetermined area on a second substrate (). Subsequently, a plurality of semiconductor thin film pieces are selected from the remaining semiconductor thin film pieces (), and bonded to a second set of predetermined area.