The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Apr. 21, 2009
Chung-chih Feng, Kaohsiung, TW;
I-peng Yao, Kaohsiung, TW;
Yung-chang Hung, Kaohsiung, TW;
Chun-ta Wang, Kaohsiung, TW;
Chung-Chih Feng, Kaohsiung, TW;
I-Peng Yao, Kaohsiung, TW;
Yung-Chang Hung, Kaohsiung, TW;
Chun-Ta Wang, Kaohsiung, TW;
Bestac Advanced Material Co., Ltd., Taoyuan County, TW;
Abstract
The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.