The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2013

Filed:

Jun. 25, 2008
Applicants:

Woo-ram Lee, Daejeon, KR;

Sang-ho Kim, Daejeon, KR;

Sung-ho Yoon, Daejeon, KR;

Inventors:

Woo-Ram Lee, Daejeon, KR;

Sang-Ho Kim, Daejeon, KR;

Sung-Ho Yoon, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01G 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A CuO spherical assembly particle composition is composed of CuO spherical assembly particles, each of which is formed by agglomerating a plurality of CuO ultrafine particles that have an average diameter in the range from 1 to 100 nm and a standard deviation on the diameter in the range from 0 to 10%. The CuO spherical assembly particles have an average diameter in the range from 0.1 to 10 μm and a standard deviation on the diameter in the range from 0 to 40%. This CuO spherical assembly particle composition is composed of CuO assembly particles with excellent uniformity, so it shows excellent properties such as realizing a good electric conductivity during a curing process for wiring. Accordingly, the spherical CuO assembly particle composition may be usefully used as precursors for solar energy conversion, magnetic storage medium, catalyst, gas sensor, and copper wire formation.


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