The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Aug. 21, 2009
Lars Herbeck, Veltheim, DE;
Thorsten Mahrholz, Salzgitter, DE;
Tobias Stroehlein, Braunschweig, DE;
Juergen Mosch, Braunschweig, DE;
Michael Frauenhofer, Braunschweig, DE;
Stefan Boehm, Schwuelper, DE;
Klaus Dilger, Braunschweig, DE;
Harald Haeger, Luedinghausen-Seppenrade, DE;
Christian Baron, Haltern am See, DE;
Markus Pridoehl, Grosskrotzenburg, DE;
Lars Herbeck, Veltheim, DE;
Thorsten Mahrholz, Salzgitter, DE;
Tobias Stroehlein, Braunschweig, DE;
Juergen Mosch, Braunschweig, DE;
Michael Frauenhofer, Braunschweig, DE;
Stefan Boehm, Schwuelper, DE;
Klaus Dilger, Braunschweig, DE;
Harald Haeger, Luedinghausen-Seppenrade, DE;
Christian Baron, Haltern am See, DE;
Markus Pridoehl, Grosskrotzenburg, DE;
Evonik Degussa GmbH, Essen, DE;
Abstract
A production method for producing molded articles from fiber composites, superparamagnetic particles are selected which become coupled to an external alternating magnetic field. These superparamagnetic particles are added to a resin portion of a strip-shaped starting material further comprising reinforcing fibers. The strip-shaped starting material is then continuously advanced, and, while being advanced, heated by coupling-in an external alternating magnetic field to which the superparamagnetic particles in the resin portion become coupled. Next, the heated starting material is continuously molded into a molded article; and the resin portion in the molded particle is cured.