The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2013

Filed:

Jun. 11, 2010
Applicants:

Yutaka Takeshima, Nagaokakyo, JP;

Masanobu Nomura, Tsukuba, JP;

Inventors:

Yutaka Takeshima, Nagaokakyo, JP;

Masanobu Nomura, Tsukuba, JP;

Assignee:

Murata Manufacturing Co., Ltd., Nagaokakyo-Shi, Kyoto-fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/00 (2006.01); H01G 5/00 (2006.01); H01G 7/00 (2006.01); H01G 9/00 (2006.01); H01G 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for producing a thin film laminated capacitor that makes it possible to reduce the number of operations for etching its electrode layers and its dielectric layers. On a substrate, a capacitor part is formed wherein n electrode layers and (n−1) dielectric layers are alternately laminated onto each other, wherein n is 4 or more. The capacitor part is etched from the same side k times. In any ietching operation, through holes are formed in an amount corresponding to respective alayers of the electrode layers and the dielectric layers. At least one of a's is set to 2 or more, and k is made smaller than n−1, thereby making it possible to make the 2to nlayers of the electrode layers from the etching starting side exposed at the bottom surfaces of the through holes.


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