Heat-dissipating device for supplying cold airflow

Abstract

A heat-dissipating device () includes a casing () and a thermal insulation plate () provided within the casing (). The thermal insulating plate () divides the interior of the casing () into a first accommodating space () and a second accommodating space (). A hot air outlet () and a first air inlet () of the casing () are in communication with the first accommodating space (). A cold air outlet () and a second air inlet () of the casing () are in communication with the second accommodating space (). A thermoelectric cooling chip () is disposed in a through-hole () of the thermal insulation plate () and has a hot-end surface () facing the first accommodating space () and a cold-end surface () facing the second accommodating space (). A heat-dissipating module () is received in the first accommodating space (). A cold-airflow supplying module () is received in the second accommodating space (). The heat generated by the hot-end surface () is dissipated to the hot air outlet () by the thermal conduction of the heat-dissipating module (). The cold generated by the cold-end surface () is conducted and distributed uniformly by the cold-airflow supplying module () to the cold air outlet ().