The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2013
Filed:
Jan. 28, 2011
Masahiro Yoshimatsu, Saitama, JP;
Masahiro Yoshimatsu, Saitama, JP;
Nihon Dempa Kogyo Co., Ltd., Tokyo, JP;
Abstract
Methods are provided for manufacturing piezoelectric devices. In an exemplary method, a base wafer is prepared that defines an array of multiple bases. Between each base on the wafer is a through-hole defined in respective parts by the respective edge surfaces of adjacent bases. A piezoelectric wafer is prepared that defines an array of multiple piezoelectric frames each having a piezoelectric vibrating piece and a surrounding frame portion. The vibrating piece includes an excitation electrode and extraction electrode. The extraction electrode extends to the through-hole. An adhesive is applied to a surface of the frame portion including a surface of the extraction electrode. The adhesive bonds the piezoelectric wafer to the base wafer. Excess adhesive is removed from the through-hole to expose a portion of the extraction electrode in the through-hole. An external electrode is formed on the outer surface of the base and extends to the through-hole in which the external electrode covers the edge surface of the through-hole, an edge surface of the adhesive, and the exposed portion of the extraction electrode.