The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8340112 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 25, 2012

Filed:

Mar. 25, 2010
Applicants:

Phillip Rogers Hillier, Iii, Rochester, MN (US);

David Alan Shedivy, Rochester, MN (US);

Kenneth Michael Valk, Rochester, MN (US);

Inventors:

Phillip Rogers Hillier, III, Rochester, MN (US);

David Alan Shedivy, Rochester, MN (US);

Kenneth Michael Valk, Rochester, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04L 12/54 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and circuit for implementing enhanced link bandwidth for a headless interconnect chip in a local rack interconnect system, and a design structure on which the subject circuit resides are provided. The headless interconnect chip includes a cut through switch and a store and forward switch. A packet is received from an incoming link to be transmitted on an outgoing link on the headless interconnect chip. Both the cut through switch and the store and forward switch are selectively used for moving packets received from the incoming link to the outgoing link on the headless interconnect chip.


Find Patent Forward Citations

Hillier, III, Phillip. (2012). Implementing enhanced link bandwidth in a headless interconnect chip (U.S. Patent No. 8340112). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8340112

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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