The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
May. 15, 2008
Shinya Yoro, Shizuoka, JP;
Kazuhiro Kobayashi, Shizuoka, JP;
Yasuhiro Suzuki, Shizuoka, JP;
Yasunori Naitoh, Shizuoka, JP;
Yasuyoshi Hongashi, Shizuoka, JP;
Shinya Yoro, Shizuoka, JP;
Kazuhiro Kobayashi, Shizuoka, JP;
Yasuhiro Suzuki, Shizuoka, JP;
Yasunori Naitoh, Shizuoka, JP;
Yasuyoshi Hongashi, Shizuoka, JP;
Abstract
[Problems] To provide a component placing apparatus capable of effectively preventing the occurrence of a suction error by appropriately adjusting a displacement between respective coordinate systems of a placing head and imaging device while efficiently performing suction position recognition using the imaging device that is movable independently of the placing head. [Means for Solving the Problems] A component mounting apparatus () includes a placing head () that transports a chip component () supplied from a component supply portion () by sucking the chip component (), and a suction position recognition camera () that is provided to be movable independently of the placing head () and takes an image of the chip component () before the placing head () sucks the chip component () from the component supply portion (). A control unit () that controls an operation of the component mounting apparatus () checks a correlation of the respective coordinate systems of the placing head () and the suction position recognition camera () at predetermined timing and corrects an amount of movement when the placing head () accesses the chip component () in the component supply portion () on the basis of this correlation.