The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Dec. 29, 2009
Applicants:
Byung-deuk Jeon, Gyeonggi-do, KR;
Dong-geum Kang, Gyeonggi-do, KR;
Young-jun Yoon, Gyeonggi-do, KR;
Inventors:
Assignee:
Hynix Semiconductor, Inc., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor integrated circuit includes a bump pad through which data is outputted, a probe test pad having a larger size than the bump pad, a first output drive unit configured to drive the bump pad at a first drivability in response to output data, a second output drive unit configured to drive the probe test pad at a second drivability higher than the first drivability in response to the output data, and a multiplexing unit configured to transfer the output data to the first output drive unit or the second output drive unit in response to a test mode signal.