The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Feb. 17, 2009
Kazuyuki Ono, Anjo, JP;
Yoshio Tanaka, Koka, JP;
Kiyoshi Nakajima, Higashiomi, JP;
Naoto Kuratani, Kameoka, JP;
Tomofumi Maekawa, Osaka, JP;
Kazuyuki Ono, Anjo, JP;
Yoshio Tanaka, Koka, JP;
Kiyoshi Nakajima, Higashiomi, JP;
Naoto Kuratani, Kameoka, JP;
Tomofumi Maekawa, Osaka, JP;
OMRON Corporation, Kyoto, JP;
Abstract
An electronic component has a substrate, a die bonding pad provided on an upper surface of the substrate, a semiconductor element bonded onto the die bonding pad by a die bonding resin, a conductive pattern disposed adjacent to the die bonding pad, and a coating member covering the conductive pattern. At least an outer peripheral portion of a surface of the die bonding pad is made of an inorganic material. The inorganic material of the outer peripheral portion is exposed. The die bonding pad and the conductive pattern are separated by an air gap such that the coating member does not come into contact with the die bonding pad.