The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2012

Filed:

Mar. 16, 2011
Applicants:

Albert Wu, Palo Alto, CA (US);

Scott Wu, San Jose, CA (US);

Inventors:

Albert Wu, Palo Alto, CA (US);

Scott Wu, San Jose, CA (US);

Assignee:

Marvell World Trade Ltd., St. Michael, BB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the present disclosure provide a substrate having (i) a first laminate layer, (ii) a second laminate layer, and (iii) a core material that is disposed between the first laminate layer and the second laminate layer; and a die attached to the first laminate layer, the die having an interposer bonded to a surface of an active side of the die, the surface comprising (i) a dielectric material and (ii) a bond pad to route electrical signals of the die, the interposer having a via formed therein, the via being electrically coupled to the bond pad to further route the electrical signals of the die, wherein the die and the interposer are embedded in the core material of the substrate. Other embodiments may be described and/or claimed.


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