The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Mar. 17, 2011
Honam Kwon, Kawasaki, JP;
Hideyuki Funaki, Tokyo, JP;
Hiroto Honda, Yokohama, JP;
Hitoshi Yagi, Yokohama, JP;
Ikuo Fujiwara, Yokohama, JP;
Masaki Atsuta, Yokosuka, JP;
Kazuhiro Suzuki, Tokyo, JP;
Keita Sasaki, Yokohama, JP;
Koichi Ishii, Kawasaki, JP;
Honam Kwon, Kawasaki, JP;
Hideyuki Funaki, Tokyo, JP;
Hiroto Honda, Yokohama, JP;
Hitoshi Yagi, Yokohama, JP;
Ikuo Fujiwara, Yokohama, JP;
Masaki Atsuta, Yokosuka, JP;
Kazuhiro Suzuki, Tokyo, JP;
Keita Sasaki, Yokohama, JP;
Koichi Ishii, Kawasaki, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
An uncooled infrared image sensor according to an embodiments includes: a plurality of pixel cells formed in a first region on a semiconductor substrate; a reference pixel cell formed in a second region on the semiconductor substrate and corresponding to each row or each column of the pixel cells; a supporting unit formed for each of the pixel cell and supporting a corresponding pixel cell; and an interconnect unit formed for each reference pixel cell. Each of the pixel cells includes: a first infrared absorption film and a first heat sensitive element. The reference pixel cell includes: a second infrared absorption film and a second heat sensitive element, the second heat sensitive element having the same characteristics as characteristics of the first heat sensitive element. The third and fourth interconnects of the interconnect unit have the same electrical resistance as electrical resistance of the first and second interconnects of the supporting unit.