The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Aug. 25, 2010
Gen Watari, Fukuoka-ken, JP;
Satoshi Shimizu, Fukuoka-ken, JP;
Hiroaki Oshio, Fukuoka-ken, JP;
Tatsuo Tonedachi, Fukuoka-ken, JP;
Kazuhisa Iwashita, Fukuoka-ken, JP;
Tetsuro Komatsu, Fukuoka-ken, JP;
Teruo Takeuchi, Fukuoka-ken, JP;
Gen Watari, Fukuoka-ken, JP;
Satoshi Shimizu, Fukuoka-ken, JP;
Hiroaki Oshio, Fukuoka-ken, JP;
Tatsuo Tonedachi, Fukuoka-ken, JP;
Kazuhisa Iwashita, Fukuoka-ken, JP;
Tetsuro Komatsu, Fukuoka-ken, JP;
Teruo Takeuchi, Fukuoka-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.