The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Jul. 28, 2010
Applicant:
Tadashi Nagasawa, Yasu, JP;
Inventor:
Tadashi Nagasawa, Yasu, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
A circuit substrate includes a base and conductive layers disposed on lower and upper surfaces of the substrate. The base includes resin layers and the conductive layers overlapping with each other in a plan view. The resin layers include first resin layers and a second resin layer interposed between the first resin layers. The first resin layer has a filler and the second resin layer has no filler or a filler whose amount is 1 volume % or less and smaller than an amount of the filler in the first resin layer.