The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Jun. 25, 2007
Hiroaki Sakata, Ehime, JP;
Nobuyuki Tomioka, Ehime, JP;
Shiro Honda, Ehime, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
The present invention relates to an epoxy resin composition comprising the following [A], [A'], [B], and [C]: [A] a bisphenol-type epoxy resin having a glass transition temperature or melting point of 50° C. or higher; [A′] an epoxy resin which is in a liquid state at 25° C.; [B] an epoxy resin curing agent; and [C] at least one block copolymer selected from the group consisting of S-B-M, B-M, and M-B-M, wherein the blocks are linked to each other by a covalent bond or by an intermediate molecule bound to one of the blocks via one covalent bond formation and to the other block via another covalent bond formation; the block M is a methyl methacrylate homopolymer or a copolymer comprising at least 50% by weight of methyl methacrylate; the block B is incompatible with the block M and has a glass transition temperature of 20° C. or lower; and the block S is incompatible with the blocks B and M and has a glass transition temperature higher than that of the block B, a prepreg obtained by impregnating a fiber base with the epoxy resin composition, and a fiber-reinforced composite material obtained by curing the prepreg.