The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Jul. 31, 2008
Applicants:
Jong-won Lee, Seongnam-si, KR;
Chang-ki Hong, Seongnam-si, KR;
Sang-yeob Han, Anyang-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided may be a slurry composition for chemical mechanical polishing (CMP) and a CMP method using the same. For example, the slurry composition may include a first polishing inhibitor including at least one of POor HPOand a second polishing inhibitor, which may be a C-Chydrocarbon compound having —SOH or —OSOH. By using the slurry composition for CMP and a CMP method using the same, increased selectivity to SiN may be obtained.
Lee, Jong-won. (2012). Slurry composition for chemical-mechanical polishing and method of chemical-mechanical polishing with the same (U.S. Patent No. 8338300). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8338300
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile