The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2012

Filed:

May. 31, 2007
Applicants:

Junichi Narita, Ibaraki, JP;

Hiroyuki Wakai, Ibaraki, JP;

Inventors:

Junichi Narita, Ibaraki, JP;

Hiroyuki Wakai, Ibaraki, JP;

Assignee:

Tohcello Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/06 (2006.01); B32B 27/16 (2006.01); B32B 27/20 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object of the present invention is to provide a polylactic acid composition having specific thermal characteristics and gas barrier properties, and to obtain a molding comprising a polylactic acid composition of PLLA and PDLA capable of forming a polylactic acid stretched film or other molding having superior surface smoothness, transparency, heat resistance and toughness, and the constitution thereof is characterized by being a molding comprising a polylactic acid composition in which the peak in DSC measurement during cooling (at a rate of 10° C./min) after allowing to remain at 250° C. for 10 minutes is 30 mJ/mg or more, and preferably comprising a polylactic acid composition such that, in measurement during the DSC 2nd heating (cooling at a rate of 10° C./min after allowing to remain at 250° C. for 10 minutes followed by reheating from 0° C. at a rate of 10° C./min), the peak ratio (peak 1/peak 2) of the peak when Tm is 150 to 180° C. (peak 1) to the peak when Tm is 200 to 240° C. (peak 2) is 0.5 or less; and a molding comprising a composition in which an inorganic filler is incorporated in the composition described above.


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