The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2012
Filed:
Jan. 05, 2010
Kazuyuki Itano, Tokyo, JP;
Hiroya Fukunga, Tokyo, JP;
Hirokatsu Shinano, Tokyo, JP;
Rieko Hamada, Tokyo, JP;
Takahiro Otsuka, Tokyo, JP;
Kazuyuki Itano, Tokyo, JP;
Hiroya Fukunga, Tokyo, JP;
Hirokatsu Shinano, Tokyo, JP;
Rieko Hamada, Tokyo, JP;
Takahiro Otsuka, Tokyo, JP;
Adeka Corporation, Tokyo, JP;
Abstract
A sealant for a one drop fill process of the invention contains the following components (1), (2), (3), and (4): (1) a curing agent composed of a reaction product produced by reacting an acid compound and a polyamine containing, within its molecule, at least one active hydrogen and at least two nitrogen atoms; (2) a heat-curable resin; (3) an acylphosphine-based photoinitiator; and (4) a photo-curable resin. A heat-curable resin containing a bisphenol A propylene oxide-modified epoxy resin is preferably used as the heat-curable resin (2), and a photo-curable resin containing a bisphenol A acrylate-modified resin is preferably used as the photo-curable resin (4).