Method for improving yield rate using redundant wire insertion

Abstract

A method and apparatus for manufacturing an integrated circuit (IC), the method including, generating, by a graphical construction unit, a first graph corresponding to a first net of the IC, the first graph representing a pin of the first net as a vertex, and a connection between two pins of the first net as an edge, the first graph further corresponding to a first IC layout; identifying a first and a second pair of unconnected vertices in the first graph for inserting a first and a second redundant edge, respectively, the first redundant edge and the second redundant edge forming a first connected loop and a second connected loop, respectively, each loop further including at least two edges of the first graph; calculating a tolerance ratio for the first redundant edge and the second redundant edge; sorting the first and second redundant edge based on their tolerance ratio; calculating a yield rate change of the first IC layout associated with inserting one of the first or second redundant edge with a highest tolerance ratio, and updating the first IC layout to include the redundant edge with the highest tolerance ratio if the yield rate change is greater than zero; and calculating the yield rate change of the first IC layout associated with inserting the first or second redundant edge having a second highest tolerance ratio, and updating the first IC layout to include the redundant edge with the second highest tolerance ratio if the yield rate change is greater than zero.