The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2012

Filed:

Aug. 05, 2009
Applicants:

Masahiro Osugi, Kanagawa-ken, JP;

Takayoshi Ohtsu, Kanagawa-ken, JP;

Shigeo Fujita, Kanagawa-ken, JP;

Katsuro Watanabe, Kanagawa-ken, JP;

Koji Kataoka, Kanagawa-ken, JP;

Inventors:

Masahiro Osugi, Kanagawa-ken, JP;

Takayoshi Ohtsu, Kanagawa-ken, JP;

Shigeo Fujita, Kanagawa-ken, JP;

Katsuro Watanabe, Kanagawa-ken, JP;

Koji Kataoka, Kanagawa-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/33 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to one embodiment, a CPP magnetoresistive head includes a magnetoresistive film comprising a free layer above a non-magnetic intermediate layer and a fixed layer below the non-magnetic intermediate layer, wherein the magnetoresistive film is between a lower magnetic shield layer and an upper magnetic shield layer. The CPP magnetoresistive head also includes a domain control film on each side of the magnetoresistive film, wherein a sense current flows through the magnetoresistive film between the upper magnetic shield layer and the lower magnetic shield layer. The CPP magnetoresistive head also includes a high heat conductivity layer, and a heat dissipation layer having a high heat conductivity and a low linear expansion coefficient, the heat dissipation layer being disposed at the back in a device height direction of the magnetoresistive film and on each side of the domain control film.


Find Patent Forward Citations

Loading…