The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2012
Filed:
Feb. 09, 2011
Soshi Kuroda, Kanagawa, JP;
Masatoshi Yasunaga, Kanagawa, JP;
Hironori Matsushima, Kanagawa, JP;
Kenya Hironaga, Kanagawa, JP;
Soshi Kuroda, Kanagawa, JP;
Masatoshi Yasunaga, Kanagawa, JP;
Hironori Matsushima, Kanagawa, JP;
Kenya Hironaga, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
Technology capable of preventing the deterioration of the reliability of semiconductor devices caused by the gasification of a part of the material constituting a wiring substrate is provided. A wiring layer constituting a circuit pattern is formed over each of the front and rear surfaces of a glass epoxy substrate, and after the formation of a solder resist covering the wiring layer while exposing a part of the wiring layer and prior to a heat treatment (first heat treatment) at 100° C. to 150° C. for dehumidification, a heat treatment (second heat treatment) at 160° C. to 230° C. for gasifying and discharging an organic solvent contained in the material constituting a wiring substrate is performed for the wiring substrate.