The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2012

Filed:

Jun. 20, 2011
Applicants:

Bo-yun Choi, Daejeon, KR;

Byung-ju Choi, Daejeon, KR;

Woo-jae Jeong, Daejeon, KR;

Kwang-joo Lee, Daejeon, KR;

Min-su Jeong, Daejeon, KR;

Inventors:

Bo-Yun Choi, Daejeon, KR;

Byung-Ju Choi, Daejeon, KR;

Woo-Jae Jeong, Daejeon, KR;

Kwang-Joo Lee, Daejeon, KR;

Min-Su Jeong, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/00 (2006.01); G03C 1/00 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a photo-sensitive resin composition having superior heat-resistant and mechanical property, and a protective film for printed circuit board, and particularly provides a photo-sensitive resin composition including an acid-modified oligomer, a photo-polymerizable monomer, a photo-initiator, an epoxy resin, and a butadiene-modified epoxy resin including epoxy group and at least one double bond in the main chain, and a protective film for printed circuit board prepared by using the composition.


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