The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2012
Filed:
Dec. 02, 2009
John Kline, Danbury, CT (US);
John Kline, Danbury, CT (US);
Pitney Bowes Inc., Stamford, CT (US);
Abstract
A method for producing an envelope having improved seal integrity, comprising the steps of (i) applying a first conductive material to the flap of the envelope in an first area corresponding to a first seal location between the flap and the body portion of the envelope and (ii) applying a second conductive material to the body portion of the envelope in a second area corresponding to a second seal location between the body portion and flap of the envelope, the first and second seal locations being selected such that an end of the first conductive material contacts an end of the second conductive material when the conductive materials are arranged in a substantially common plane. The method further comprises the steps of sealing the flap to the body portion by closing the flap onto the body portion of the envelope to cause the conductive materials to lie in the substantially common plane, and inspecting the sealing interface to determine whether the conductive materials exhibit a property of electrical continuity thereby confirming that a seal has been formed between the flap and body portion of the envelope. A system and article is also described for producing an envelope having improved seal integrity.