The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2012

Filed:

Jul. 20, 2007
Applicants:

Johannes W. Weekamp, Beek en Donk, NL;

Samuel R. Peters, Burnham, PA (US);

Richard E. Davidsen, Andover, MA (US);

Wojtek Sudol, Andover, MA (US);

Inventors:

Johannes W. Weekamp, Beek en Donk, NL;

Samuel R. Peters, Burnham, PA (US);

Richard E. Davidsen, Andover, MA (US);

Wojtek Sudol, Andover, MA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An ultrasound transducer () comprises an application specific integrated circuit (ASIC) (), an array of acoustic elements (), and a pitch independent interposer (). The ASIC () includes a plurality of contact pads () on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements () of the array () are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer () features a plurality of conductive elements () separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch. The pitch independent interposer () is electrically coupled (i) on a first side to the ASIC via a first subset of the plurality of conductive elements and (ii) on a second side to the array of acoustic elements via a second subset of the plurality of conductive elements, wherein one or more of the plurality of conductive elements () electrically couples a contact pad () of the ASIC () with a corresponding acoustic element () of the array () of acoustic elements.


Find Patent Forward Citations

Loading…