The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2012
Filed:
Jun. 02, 2011
Toshiyuki Takewaki, Kanagawa, JP;
Manabu Iguchi, Kanagawa, JP;
Daisuke Oshida, Kanagawa, JP;
Hironori Toyoshima, Kanagawa, JP;
Masayuki Hiroi, Kanagawa, JP;
Takuji Onuma, Kanagawa, JP;
Hiroaki Nanba, Kanagawa, JP;
Ichiro Honma, Kanagawa, JP;
Mieko Hasegawa, Kanagawa, JP;
Yasuaki Tsuchiya, Kanagawa, JP;
Toshiji Taiji, Kanagawa, JP;
Takaharu Kunugi, Kanagawa, JP;
Toshiyuki Takewaki, Kanagawa, JP;
Manabu Iguchi, Kanagawa, JP;
Daisuke Oshida, Kanagawa, JP;
Hironori Toyoshima, Kanagawa, JP;
Masayuki Hiroi, Kanagawa, JP;
Takuji Onuma, Kanagawa, JP;
Hiroaki Nanba, Kanagawa, JP;
Ichiro Honma, Kanagawa, JP;
Mieko Hasegawa, Kanagawa, JP;
Yasuaki Tsuchiya, Kanagawa, JP;
Toshiji Taiji, Kanagawa, JP;
Takaharu Kunugi, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A post-CMP cleaning process of a copper layer is to be performed as follows. An alkaline aqueous solution, a polycarboxylic acid, BTA, and an alkaline aqueous solution are sequentially brought into contact with a primary surface of a silicon substrate over which the copper layer is provided.